Vacuum
Pump-down and pressure-rise curves are the minimum records for separating pump capability, leak rate, outgassing and virtual-leak behaviour.
dP/dt = Q/V - (S/V)·P
Diffusion
LPC, nitriding and carburizing need a diffusion kernel and measured profile data. Process transfer needs measured profiles, not recipe names alone.
∂C/∂t = ∂/∂x[D(C,T)·∂C/∂x]
Thermal
Hot-zone, cathode and TVAC reviews require a thermal balance: input power, radiation, conduction, gas heat transfer and fixture/load mass.
Cth·dT/dt = Pin - Ploss
Plasma
Plasma process review connects bias, pressure, ion flux, gas chemistry and surface state to adhesion, activation, nitriding or etching behaviour.
R = f(Γi, Eion, chemistry, T)