PVD, CVD and PECVD are not competing labels only; they represent different process physics, equipment architectures and application windows.
Process approach
PVD is generally line-of-sight or source-geometry dependent; CVD can be strong for complex geometry and internal surfaces; PECVD reduces thermal load by adding plasma activation.
Equipment consequences
Selection depends on source technology, temperature, vacuum/gas system, substrate geometry, coating chemistry, uniformity needs and acceptance criteria.
Decision use
A practical comparison must start from the component and operating environment rather than from a preferred equipment label.